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IFX25401
Low Dropout Linear Voltage Regulator
IFX25401TBV IFX25401TEV IFX25401TBV50 IFX25401TEV50
Data Sheet
Rev. 1.01, 2009-10-19
Standard Power
Low Dropout Linear Voltage Regulator
IFX25401
Features * * * * * * * * * Output Voltage Versions: 5V and Adjustable Very Low Current Consumption 400 mA Output Current Capability Very Low Dropout Voltage Output Current Limitation Overtemperature Shutdown Reverse Polarity Protection Wide Temperature Range; -40 C to 125 C Green Product (RoHS compliant) PG-TO263-5
Applications * * * * * Manufacturing Automation Appliances HDTV Televisions Game Consoles Network Routers
For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series. PG-TO252-5
Description
The IFX25401 is a monolithic integrated low dropout voltage regulator for load currents up to 400 mA. An input voltage up to 40 V is regulated to an adjustable voltage with a precision of 2%. The device is designed for harsh environments. Therefore it is protected against overload, short circuit and overtemperature conditions by the implemented output current limitation and the overtemperature shutdown circuit. The adustable output can be configured to regulate between 2.5 V and 20 V. Due to its very low quiescent current the IFX25401 is dedicated for use in applications permanently connected to a battery.
Type IFX25401TBV IFX25401TEV IFX25401TBV50 IFX25401TEV50 Data Sheet
Package PG-TO263-5 PG-TO252-5 PG-TO263-5 PG-TO252-5 2
Marking 25401V 25401V 25401V50 2540150 Rev. 1.01, 2009-10-19
IFX25401
Block Diagram
1
Block Diagram
Temperature Sensor
Saturation Control and Protection Circuit 5 Control Amplifier Q
1
Buffer
Bandgap Reference *) **) 2 EN *) For fixed Voltage Regulator only **) For adjustable Voltage Regulator only
Figure 1 Block Diagram
4 VA
3 GND
AEB02044
Data Sheet
3
Rev. 1.01, 2009-10-19
IFX25401
Pin Configuration
2
2.1
Pin Configuration
Pin Assignment PG-TO263-5, PG-TO252-5
GND
GND
1 I EN n.c. VA Q
5
12345 I GND Q EN n.c. VA
PinConfig_PG-TO-263-5-1.vsd
AEP02560
Figure 2
Pin Configuration (top view)
2.2
Pin No. 1 2
Pin Definitions and Functions PG-TO263-5, PG-TO252-5
Symbol Function I EN Input block to ground directly at the IC with a ceramic capacitor Enable high level input signal enables the IC; low level input signal disables the IC; integrated pull-down resistor Ground internally connected to heat slug Not Connected for IFX25401TBV50, IFX25401TEV50 can be open or connected to GND Voltage Adjust for IFX25401TBV, IFX25401TEV connect external voltage divider to configure the output voltage Output Connect a capacitor between Q and GND close to the IC pins and respect the values specified for apacitance and ESR in "Functional Range" on Page 5 Heat Slug internally connected to GND; connect to PCB/System GND and heatsink area
3 4
GND N.C. VA
5
Q
Heat Slug
-
Data Sheet
4
Rev. 1.01, 2009-10-19
IFX25401
General Product Characteristics
3
3.1
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings1) Tj = -40 C to 150 C; all voltages with respect to ground, (unless otherwise specified) Pos. Input I 3.1.1 3.1.2 Output Q 3.1.3 3.1.4 3.1.5 3.1.6 3.1.7 3.1.8 Voltage Junction temperature Storage temperature ESD Absorption Voltage Voltage Parameter Symbol Min. Limit Values Max. 45 10 40 150 150 2 500 750 V V V C C kV V V - - - - - Human Body Model (HBM)2) Charge Device Model (CDM)3) Charge Device Model (CDM) at corner pins3) Unit Test Condition
VI VVA VQ Tj Tstg VESD,HBM VESD,CDM
-42 -0.3 -1 -40 -50 -2 -500 -750
Voltage Adjust Input VA
Temperature
ESD Susceptibility
1) not subject to production test, specified by design 2) ESD susceptibility Human Body Model "HBM" according to AEC-Q100-002 - JESD22-A114 3) ESD susceptibility Charged Device Model "CDM" according to ESDA STM5.3.1
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation.
3.2
Pos. 3.2.9
Functional Range
Parameter Input voltage Symbol Limit Values Min. Max. 40 V IFX25401TBV, IFX25401TEV; IFX25401TBV50, IFX25401TEV50 VQ > 4 V IFX25401TBV, IFX25401TEV; Unit Remarks
VI
VQ +
0.5
3.2.10
Input voltage
VI
4.5
40
V
VQ < 4 V
Data Sheet
5
Rev. 1.01, 2009-10-19
IFX25401
General Product Characteristics Pos. 3.2.11 3.2.12 3.2.13 Parameter Output Capacitor's Requirements for Stability Junction temperature Symbol Limit Values Min. Max. - 3 125 F C
1) 2)
Unit
Remarks
CQ 22 ESR(CQ) - Tj -40
-
1) the minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30% 2) relevant ESR value at f = 10 kHz
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table.
3.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Pos. Parameter Symbol Min. IFX25401TBV, IFX25401TBV50 (PG-TO263-5) 3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 IFX25401TEV, IFX25401TEV50 (PG-TO252-5) 3.3.6 3.3.7 3.3.8 3.3.9 3.3.10 Junction to Case1) Junction to Ambient1) Junction to Case1) Junction to Ambient1) Limit Values Typ. 4 22 74 42 34 Max. - - - - - K/W K/W K/W K/W K/W measured to heat slug
2)
Unit
Conditions
RthJC RthJA
- - - - -
footprint only3) 300 mm heatsink area3) 600 mm heatsink area3) measured to heat slug
2)
RthJC RthJA
- - - - -
4 27 115 52 40
- - - - -
K/W K/W K/W K/W K/W
footprint only3) 300 mm heatsink area3) 600 mm heatsink area3)
1) Not subject to production test, specified by design. 2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70m Cu, 2 x 35m Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer. 3) Specified RthJA value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with 1 copper layer (1 x 70m Cu).
Data Sheet
6
Rev. 1.01, 2009-10-19
IFX25401
Electrical Characteristics
4
4.1
Electrical Characteristics
Electrical Characteristics Voltage Regulator
Electrical Characteristics VI =13.5 V; Tj = -40 C to 125 C; all voltages with respect to ground (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Output Q 4.1.1 Output Voltage Accuracy1) Typ. - Max. 2 % IFX25401TBV, IFX25401TEV R2 < 50 k; VQ + 1 V VI 40V; VI > 4.5 V; 5 mA IQ 400 mA IFX25401TBV50 IFX25401TEV50 6 V VI 28 V; 5 mA IQ 400 mA IFX25401TBV, IFX25401TEV; Refer to Page 12
IQ = 250 mA VI > 4.5 V; Vdr = VI - VQ2) IQ = 5 mA to 400 mA VI = 4.5 V Vl = 12 V to 32 V IQ = 5 mA
2)
Unit
Measuring Condition
VQ
-2
4.1.2
Output Voltage
VQ
4.9
5.0
5.1
V
4.1.3
Output Voltage Adjustable Range3) VQ,range
2.5
-
20
V
4.1.4
Dropout Voltage
Vdr
-
250
500
mV
4.1.5 4.1.6 4.1.7 4.1.8 4.1.9
Load Regulation Line Regulation Output Current Limitation Power Supply Ripple Rejection
3) 3)
VQ, lo VQ, li
- - 400 - -
5 15 600 54 0.5
35 25 1100 - -
mV mV mA dB mV/K
IQ
PSRR dV Q ---------dT
fr = 100 Hz; Vr = 0.5 Vpp
Temperature Output Voltage Drift
-
Data Sheet
7
Rev. 1.01, 2009-10-19
IFX25401
Electrical Characteristics Electrical Characteristics VI =13.5 V; Tj = -40 C to 125 C; all voltages with respect to ground (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Current Consumption 4.1.10 4.1.11 4.1.12 4.1.13 Current Consumption, Regulator Disabled Quiescent Current Iq = II - IQ Current Consumption Iq = II - IQ Current Consumption Iq = II - IQ Typ. - 100 5 15 Max. 10 220 10 25 A A mA mA Unit Measuring Condition
Iq Iq Iq Iq
- - - -
VEN = 0 V
Tj 100 C IQ = 1 mA; VEN = 5 V IQ = 250 mA; VEN = 5 V IQ = 400 mA; VEN = 5 V
1) influence of resistor divider on accuracy neglected 2) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V. 3) not subject to production test, specified by design
Data Sheet
8
Rev. 1.01, 2009-10-19
IFX25401
Electrical Characteristics
4.2
Typical Performance Characteristics Voltage Regulator
Current Consumption Iq versus Output Current IQ
16 14 12 10 8 6 4 2 0 0 100 200 300 400
01_IQ_IQ.VSD
Current Consumption Iq versus Low Output Current IQ
1,4 1,2
02_IQ_IQLOW.VSD
V I = 13.5 V T j = 25 C
1
V I = 13.5 V T j = 25 C
I q [mA]
I q [mA]
0,8 0,6 0,4 0,2 0 0 20 40 60 80 100
I Q [mA]
Output Voltage VQ versus Junction Temperature TJ
0,5 0,4 0,3 0,2
03_VQ_TJ.VSD
I Q [mA]
Dropout Voltage Vdr versus Output Current IQ
500 450 400 350
T j = 150 C T j = 25 C T j = -40 C
04_VDR_IQ.VSD
I Q = 5 mA V I = 13.5 V
V Q [%]
0 -0,1 -0,2 -0,3 -0,4 -0,5 -40 0 40 80 120 150
V DR [mV]
0,1
300 250 200 150 100 50 0 0 100 200 300 400
T j [C]
Data Sheet 9
I Q [mA]
Rev. 1.01, 2009-10-19
IFX25401
Electrical Characteristics
Dropout Voltage Vdr versus Junction Temperature
Maximum Output Current IQ versus Input Voltage VI
05_VDR_TJ.VSD
500 450 400 350
I Q = 400 mA
900 800 700 600
T j = 25 C T j = -40 C T j = 150 C
06_IQMAX_VI.VSD
V DR [mV]
I Q,max [mA]
300 250 200 150 100 50 0 -40 0 40 80 120 160
I Q = 10 mA I Q = 100 mA
500 400 300 200
V Q = V Q,nom - 100 mV
100 0 0 10 20 30 40
T j [C]
Region Of Stability: Output Capacitor's ESR ESR(CQ) versus Output Current IQ
V I [V]
10
07_ESR_IQ.VSD
Unstable Region
ESR(C Q ) [ ]
1
C Q = 22 F V I = 13.5 V Stable Region
0,1
0,01 0 100 200 300 400
I Q [mA]
Data Sheet
10
Rev. 1.01, 2009-10-19
IFX25401
Application Information
5
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device.
Input
I1
5Q
Output
CI
e.g. KL 15 EN 2
IFX25401 3 GND 4
*)
CQ
R 1*)
VA
Voltage Adjust
R 2*)
*) Optional
for adjustable Voltage Regulator
Figure 3
Application Diagram
A typical application circuit of the IFX25401 is shown in Figure 3. It shows a generic configuration of the voltage regulator with a recommended minimum number of components. The small input capacitor is not required but recommended for high frequency noise filtering. For a normal operation the fixed output voltage regulator only requires an output capacitor for stability. The adjustable output regulator requires an additional resistor network to configure the output voltage. Depending on the application conditons, additional components such as an input buffer capacitor or a reverse polarity protection diode can be considered as well. Input Filter Capacitor A small ceramic capacitor (e.g. 100nF in Figure 3) at the device's input helps filtering high frequency noise. To reach the best filter effect, this capacitor should be placed as close as possible to the device's input pin. The input filter capacitor does not have an influence on the stability of the device's regulation loop. Output Capacitor CQ The output capacitor is the only external component that is required because it is part of the regulation loop. To maintain stability of this regulation loop, the IFX25401 requires an output capacitor respecting the values given in "Functional Range" on Page 5. Adjusting the Output Voltage of Variable Output Regulators IFX25401TBV, IFX25401TEV The output voltage of the IFX25401TBV and the IFX25401TEV can be adjusted between 2.5 V and 20 V by an external resistor divider connected to the voltage adjust pin VA. The VA pin is connected to the internal error amplifier comparing the voltage at this pin with the internal reference voltage (i.e. 2.5 V).
Data Sheet
12
Rev. 1.01, 2009-10-19
IFX25401
Application Information
5Q
Internal Reference 2.5 V Typical
Vref
Current and Saturation Control 4 VA
R1
CQ
22 F
R2
AEB02804
Figure 4
External Components at Output for Variable Voltage Regulator
The output voltage can be easily calculated, neglecting the current flowing into the VA pin:
R1 + R2 V Q = ------------------ x V ref R2
where
R 2 < 50 k
to neglect the current flowing into the VA pin,
with: * * *
Vref: internal reference voltage, typically 2.5V R1: resistor between regulator output Q and voltage adjust pin VA R2: resistor between voltage adjust pin VA and GND
For a 2.5 V output voltage the output pin Q has to be directly connected to the adjust pin VA. Take into consideration, that the accuracy of the resistors R1 and R2 adds an additional error to the output voltage tolerance.
Data Sheet
13
Rev. 1.01, 2009-10-19
IFX25401
Package Outlines
6
Package Outlines
4.4 10 0.2 0...0.3 8.5 1) A 1.27 0.1 B 0.05
10.3
(15)
9.25 0.2
7.55 1)
2.4 0.1
0...0.15 5 x 0.8 0.1 4 x 1.7 0.25
M
4.7 0.5
2.7 0.3
0.5 0.1
AB
8 MAX.
0.1 B
1) Typical Metal surface min. X = 7.25, Y = 6.9 All metal surfaces tin plated, except area of cut.
GPT09113
Figure 5
PG-TO263-5
Data Sheet
14
Rev. 1.01, 2009-10-19
IFX25401
Package Outlines
6.5 +0.15 -0.05 5.7 MAX.
(4.24) 1 0.1
1)
A B
0.8 0.15
2.3 +0.05 -0.10 0.5 +0.08 -0.04
(5)
9.98 0.5 6.22 -0.2
0.9 +0.20 -0.01 0...0.15
0.51 MIN.
0.15 MAX. per side
5 x 0.6 0.1 1.14
0.5 +0.08 -0.04 0.1 B
4.56
0.25 M A B
1) Includes mold flashes on each side. All metal surfaces tin plated, except area of cut.
Figure 6
PG-TO252-5
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on packages, please visit our website: http://www.infineon.com/packages. Data Sheet 15
Dimensions in mm Rev. 1.01, 2009-10-19
IFX25401
Revision History
7
Revision 1.01 1.0
Revision History
Date 2009-10-19 2009-04-28 Changes Coverpage changed Overview page: Inserted reference statement to TLE/TLF series. Initial Release
Data Sheet
16
Rev. 1.01, 2009-10-19
Edition 2009-10-19 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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